Flexible Led Circuit Board/Flexible Printed Circuits/ Welding
Resistance
About the Payment Terms:
- For moulds fees: 100% full paid in advance.
- For mass production: 60% deposit, the rest 40% been paid before
delivery.
About the delivery time:- Moulds and Samples Making Period: 32-36 workdays with 5pcs free
samples.
- Lead Time: 28-30 workdays after samples approval.
Description:
The main technical indicators
1. Max size: single sided, double sided:600mm * 500mm Multi-layer:
400mm * 600mm
2. Processing thickness:0.2mm -4.0mm
3. Copper foil substrate thickness: 18μ(1/ 2OZ ),35μ( 1OZ ),70μ(
2OZ )
4. Common material: FR-4 , CEM-3 , CEM-1,
Polytetrachloroethylene,FR-1(94V0,94HB)
5. Light copper,Nickel-plated,Gilded,HAL；Immersion
Gold,Antioxidant,HASL,Immersion Tin,etc.
Applications:
1. The mobile phone
Focuses on the flexible circuit board light weight and thin
thickness. Can effectively save the volume of products, easy
connection of the battery, microphone, and buttons and into one.
2. Computer and LCD screen
Use the one line configuration of flexible circuit boards, and thin
thickness. The digital signal into the picture, through the LCD
screen
3. CD player
Focuses on three dimensional assembly characteristics of flexible
circuit boards and thin thickness. The huge CD to carry around
4. Disk drives
Regardless of the hard disk, or diskette, is very dependent on FPC
high softness and thickness of the 0.1 mm slim, read data finish
quickly. Either a PC or NOTEBOOK.
5. The latest applications
Hard disk drives (HDDS, hard disk drive) of suspended circuit (Su
ensi. N cireuit) and the components of xe packaging board, etc
Specifications
Type | PCB | Application | Electronic Products |
Color | blue | Feature | - Energy-efficient & Low power
|
Machine Stiffness | Rigid | Lays
| Customized |
Material | PET /PC | I nsulation Material | Organic resin |
I nsulation layer thichness | General | Antiflaming Speciality | VO |
Processing Technic | Rolled foil | Reinforcing material | Glass fiber |
Insulating Resin | Polyimide resin | Export Markets | Global |
Process Capability
1. Drilling:The minimum diameter 0.1mm
2. Hole metallization:Minimum aperture 0.2mm,Thickness / aperture
ratio 4:1
3. Wire width: Minimum:Gold plate 0.10mm, Tin plate0.1mm
4. Wire spacing: Minimum:Gold plate 0.10mm, Tin plate0.1mm
5. Gold plate: nickel layer thickness:≧2.5μ,Gold layer thickness:
0.05-0.1μm or according to customer requirements
6. HASL: tin layer thickness:≧2.5-5μ
7. Paneling: Line-to-edge minimum distance: 0.15mm hole to edge
minimum distance: 0.15mm smallest form tolerance: ± 0.1mm
8. Socket chamfer: Angle: 30 degrees, 45 degrees, 60 degrees Depth:
1-3mm
9. V Cut: Angle: 30 degrees, 35 degrees, 45 degrees Depth:
thickness 2/3 Minimum size: 80mm * 80mm
